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Wafer Level Burn-In
WLBI370B
Wafer Level Burn-In System
The WLBI370B Wafer Level Burn-in System is a high-throughput, fully automated wafer-level burn-in solution. It can simultaneously perform High-Temperature Gate Bias (HTGB) and High-Temperature Reverse Bias (HTRB) burn-in testing on up to 15 wafers, with support for applying negative gate bias during HTRB burn-in. Test durations can be configured from several minutes to thousands of hours to meet the burn-in requirements of different products.
The system integrates fully automated wafer loading and unloading and features a three-cassette to support fast probe card changeover for seamless product changeover while enabling automatic switching of burn-in conditions, ensuring efficient and continuous test operation.
Highlights
  • Fully automated system
    Automated wafer and fixture loading/unloading without manual intervention
  • High throughput
    Supports simultaneous HTGB/HTRB burn-in of up to 15 wafers at full capacity
  • High compatibility
    Easy switching between 6-inch and 8-inch wafers by replacing fixtures
  • High probe mark repeatability
    Probe mark repeatability: ≤±35 µm
  • Data traceability
    Supports MAP data binding
  • High-Precision leakage current testing
    Leakage current measurement resolution: 0.1 nA
    Leakage current measurement accuracy: 0.5 nA
  • Wide temperature range
    Temperature uniformity: ≤±2 °C @ RT–175 °C
    Temperature accuracy: ≤1 °C; Resolution: 0.1 °C
  • Comprehensive system functionality
    Real-time Igss and Idss scanning at intervals of ≥1 min Integrated parallel Vth testing
    Supports nitrogen purging
    Functions and Advantages
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