NUREMBERG, Germany – June 12, 2026 – Nexustest participated in the PCIM Europe 2026 exhibition, held from June 9 to 11 at Messezentrum Nuremberg. At Booth 6-137, the company engaged with industry professionals and shared its expanding portfolio for power semiconductor and optical testing.
Advanced Test Architectures
During the event, Nexustest introduced its comprehensive range of test architectures. The team held detailed discussions on the SiC KGD Die Handler (PB6800), Wafer Level Reliability (WLR) Test Systems, and Wafer Level Burn-in (WLBI) Systems. Furthermore, Nexustest highlighted its SiPh Wafer Test System. These solutions are designed to address the industry's critical needs for mass production scaling and rigorous reliability screening.
On-site, Nexustest also demonstrated its physical PXIe Source Measure Unit (SMU) hardware. This allowed attendees to observe the system's capabilities for precise device characterization right at the booth.
